In connector electroplating, due to the high electrical performance requirements of the contact pair, the gold plating process occupies an obviously important position in the connector electroplating. At present, except for some strip connectors adopting the selective electroplating process, a large number of pins The gold plating in the hole of the hole parts is still carried out by barrel plating and vibration plating. In recent years, the volume of the connector has become more and more miniaturized, and the quality of the gold plating in the hole of the pinhole parts has become increasingly prominent. The quality requirements of the gold layer are getting higher and higher, and some users are even very picky about the appearance quality of the gold layer. In order to ensure the quality and bonding force of the gold plating layer of the connector, these common quality problems are always the key to improving the gold plating quality of the connector. Let's discuss the reasons for these quality problems one by one.